Copper Pyrophosphate

Molecular Formula:Cu2P2O74H2O
Molecular Weight:373.11
Standard:ACTI 2157-2002
Grade:Electroplating Use


Product Characteristics: Due to its high purity, unique crystal structure, and extremely low Fe, Ph, As contents, the product is much easier to be chelated by potassium pyrophosphate. Plating solution has excellent polarizing ability and current distribution ability. Fresh plating solution does not need to go through electrolysis procedure and can be directly used for electroplating. While electroplating, it has the following advantages: fast plating, smooth plating layer, regular, fine, tight, and no cavity crystal structure, stable plating solution, strong anti-interference ability, and simple maintenance.

[Cu(P2O7)2]6- == Cu2+ + 2P2O74-
Application: It is used to provide Cu2+ in non-cyanide electroplating.
For example: non-cyanide copper plating
Cu2P2O7 + 3K4P2O7 == 2K6[Cu(P2O7)2]
Chelating ion [Cu(P2O7)2]6- can dissociate in water solution as follows.
[Cu(P2O7)2]6-== Cu2+ + 2P2O74-

Technical Specification

ACTI 2157-2002 Specification´╝Ü

Typical Value

Item

Standard

Appearance

baby blue or sky blue power

baby blue or sky blue power

Purity %

99.0min

99.6min

Cu %

33.7min

33.9min

Fe %

0.005 max

0.005max

Ca %

0.0005max

0.0005max

Pb%

0.0005 max

0.0005 max

As %

0.0003 max

0.0003 max

phosphate ion %

1max

0.5max

SO4 %

0.5max

0.3max

Package

20kg

20kg